聚酰亚胺/中空玻璃微球低介电复合膜的制备及应用

朱唐宋, 王一平, 张懿, 贾叙东, 张秋红

Preparation and application of polyimide/hollow glass microsphere composite films with low dielectric properties

Tangsong Zhu, Yiping Wang, Yi Zhang, Xudong Jia, Qiuhong Zhang

附表2 PI/SiO₂?Air系列复合膜的力学数据

Appendix 2　The mechanical properties of the PI/SiO₂?Air films

Sample	TS^a (MPa)	EB^a	TM^a (GPa)	FE^a (MJ·m^-2)
Homo⁃PI	183.3±3.7	91.0±5.3%	1.54±0.20	1.366±0.160
PI⁃1	192.8±5.8	69.8±2.9%	2.24±0.17	1.097±0.075
PI⁃2	198.7±5.6	40.7±0.8%	3.64±0.04	0.696±0.112
PI⁃3	200.7±2.3	29.2±4.6%	4.03±0.10	0.517±0.129
PI⁃4	201.6±6.4	26.5±0.1%	3.42±0.01	0.448±0.055