聚酰亚胺/中空玻璃微球低介电复合膜的制备及应用

朱唐宋, 王一平, 张懿, 贾叙东, 张秋红

Preparation and application of polyimide/hollow glass microsphere composite films with low dielectric properties

Tangsong Zhu, Yiping Wang, Yi Zhang, Xudong Jia, Qiuhong Zhang

图4 PI/SiO2?Air系列复合膜的应力?应变曲线(a)及最大应力（橙）、断裂伸长率（绿）、断裂能（紫）和杨氏模量（黄）柱状图(b)

Fig.4 Stress?strain curves (a), comparison of EL (orange),tensile strength (green) and Young's modulus (purple), and fracture energy (yellow) (b) of the PI/SiO2?Air composite films