Abstract: The creation of monodisperse microsphere with micrometer size and submicrometer size has been attracting much attention in recent years owing to their wide potential applications, such as biomedical field, information industry, microelectronics, etc. In the past decade, various materials such as glass, PS and PMMA were used to synthesized monodisperse microspheres and those microspheres were applied to fabricate functional microspheres containing metallic Ag, Au, Ni and so on. However, to the best of our knowledge, MF microsphere has not been reported. Thus in this paper, the monodisperse melamine formaldehyde resin (MF) microspheres was prepared by dispersion polymerization in aqueous solution firstly. After pre-treatment of sensitization and activation, the microspheres coated with metallic nickel (MF-Ni) and silver ( MF-Ag ) were prapared with chemical plating method. The SEM and TEM results showed that MF-Ni plated under alkaline condition was of high quality than that of under acidic condition about certain characteristics, ie the thickness and completeness of the coating, the sphericity and the diameter dispersion coefficient of the microspheres. The EDS and XRD patterns implied that the microsphere of MF-Ni prepared under alkaline condition contained much more nickel than that of under acidic condition, and the microsphere of MF-Ag thus prepared contained more metallic Ag. The FT-IR spectra revealed that ionic metals such as Pd2+ and Ag+ would complexing with N in the triazine ring of melamine, which may enhance the interaction between coating metals and MF. The DTA results showed that the peak of pyrolysis of MF microspheres was about 420℃, while the peak of pyrolysis of Ni coated and Ag coated MF microspheres were 400℃ and 382℃ respectively, which imply the excellent thermostability. .The TG curves discovered that the MF-Ni contains 6% metallic Ni, and MF-Ag contains 48% metallic Ag respectively. All the properties mentioned above implied that MF-Ni and MF-Ag microspheres might be used in many fields when relatively high temperature was concerned in the applying process such as anisotropic conductive adhesive in microelectronics and so on.